Riki Chandra Wijaya, Riki (2020) Model Analisis Faktor Sebaran Data Curah Hujan Tahunan. Borneo Engineering: Jurnal Teknik Sipil. ISSN 2581-1134 (Submitted)

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Abstract

Rainfall occurs in Watershed (DAS) has special relationship. Data distribution from measuring devices at several locations in watershed is predicted to have pattern and close relationship. To know this we need a model to be able to show relationship between measured rainfall data. This research, a factor analysis model is performed to calculate how much relationship between rainfall data in watershed and to determine shape of rainfall distribution patterns that occur. Based on the calculation results, it is known that pattern of rainfall data distribution from 6 rain stations in Bengawan Solo watershed, namely doplang, randu, menden, kedung, japah, and sambong in 1998 has the same distribution pattern. However, the amount of rain height is different. In addition, the maximum Pearson correlation coefficient is 0.536 at Menden-Randu station. While the minimum Pearson correlation value for the Menden-Sambong station is 0.012. This difference is influenced by the distance between Menden-Randu and Menden-Sambong stations. Based on calculations on the factor analysis model, there are two factors that affect directly between these stations. Factor 1 has coefficient value <0.5 while factor 2 has 2 values> 0.5. Based on calculations show that rainfall that occurs in each region does not have strong relationship between one another, but the occurrence of rain that occurs has the same distribution pattern. From this it provides information that pattern of rainfall distribution each year is the same due to occurrence of rain following climate pattern in global area coverage.

Item Type:	Article
Subjects:	T Technology > TA Engineering (General). Civil engineering (General)
Divisions:	Fakultas Teknik (FT) > Prodi Teknik Sipil
Depositing User:	Riki Chandra Wijaya
Date Deposited:	19 Jun 2020 01:45
Last Modified:	19 Jun 2020 01:45
URI:	http://repository.lppm.unila.ac.id/id/eprint/22667

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