., Buhani and Sumadi, sumadi (2017) Penentuan Model dan Situs Aktif Adsorpsi Ion Cd(II) pada Hibrida Amino-silika dengan Teknik Pencetakan Ion. In: Seminar Hasil Penelitian Dasar Perguruan Tinggi Tahun 2017,, 20-21 November 2017, Swiss Bel Hotel Tanngerang. (Unpublished)

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Abstract

It has been studied the correlation between cavity fraction of Cu2+ ionic imprinting and concentration of H+ ion in solution media upon adsorbent ability of amino-silica hybrid of Cu2+ ionic imprinting (Cu(II)-IIP) in adsorbing Cu2+ ions in solution. In order to identify the active sites playing a role upon Cu2+ ion adsorption, identification of functional groups, surface morphology, element compositions, surface area, volume, and porous diameter of adsorbent were investigated in this experiment. Adsorption process was performed using batch method with interacting Cu(II)-IIP adsorbent with each cavity fraction of ionic imprinting of Cu(II)-IIP-1; Cu(II)-IIP-2; Cu(II)-IIP-3; and Cu(II)-IIP-4 of 97.69; 98.75; 97.87; 96.89 % in solution media with each concentration of H+ ion of 0.5; 1.0; 1.5; 2.5; 5.0 mmol L-1, respectively. The adsorption data obtained showed that Cu(II)-IIP with different ionic imprinting fractions gave relatively similar adsorption models, the higher the concentration of H+ ion in solution media, the lower the concentration of Cu2+ ion adsorbed on the Cu(II)-IIP adsorbent. From the evaluation results of the adsorption kinetic and adsorption isotherm parameters show that the values of the adsorption rate and capacity of ionic imprinted materials on Cu(II)-IIP-1; Cu(II)-IIP-2; Cu(II)-IIP-3; and Cu(II)-IIP-4 are bigger than non-imprinted polymer (NIP). Keywords: imprinted ionic, adsorption, aminosilica hybrid, adsorption active site.

Item Type: Conference or Workshop Item (Poster)
Subjects: Q Science > QD Chemistry
Divisions: Fakultas Matematika dan Ilmu Pengetahuan Alam (FMIPA) > Prodi Kimia
Depositing User: BUHANI
Date Deposited: 25 Jun 2018 02:33
Last Modified: 25 Jun 2018 04:57
URI: http://repository.lppm.unila.ac.id/id/eprint/7595

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