., Buhani and ., Suharso and Laila, Aspita and ., Sumadi (2017) Correlation between cavity fraction of Cu2+ ionic imprinting and concentration of H+ ion on amino-silica hybrid to Cu2+ ion adsorption. In: 4TH International Congress on Technology - Engineering & Science Conference 5th to 6th August 2017. Kuala Lumpur, Malaysia, 5-6 August 2017, Kuala Lumpur, Malaysia.

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Abstract

It has been studied the correlation between cavity fraction of Cu2+ ionic imprinting and concentration of H+ ion in solution media upon adsorbent ability of amino-silica hybrid of Cu2+ ionic imprinting (Cu(II)-IIP) in adsorbing Cu2+ ions in solution. In order to identify the active sites playing a role upon Cu2+ ion adsorption, identification of functional groups, surface morphology, element compositions, surface area, volume, and porous diameter of adsorbent were investigated in this experiment. The interaction between Cu(II)-IIP and Cu(II) ion was evaluated with a kinetic model and an adsorption isotherm to determine the adsorption rate, adsorption isotherm model, and adsorption capacity value. Adsorption process was performed using batch method with interacting Cu(II)-IIP adsorbent with each cavity fraction of ionic imprinting of Cu(II)-IIP-1; Cu(II)-IIP-2; Cu(II)-IIP-3; and Cu(II)-IIP-4 of 97.69; 98.75; 97.87; 96.89 % in solution media with each concentration of H+ ion of 0.5; 1.0; 1.5; 2.5; 5.0 mmol L-1, respectively. The adsorption data obtained showed that Cu(II)-IIP with different ionic imprinting fractions gave relatively similar adsorption models, the higher the concentration of H+ ion in solution media, the lower the concentration of Cu2+ ion adsorbed on the Cu(II)-IIP adsorbent. From the evaluation results of the adsorption kinetic and adsorption isotherm parameters show that the values of the adsorption rate and capacity of ionic imprinted materials on Cu(II)-IIP-1; Cu(II)-IIP-2; Cu(II)-IIP-3; and Cu(II)-IIP-4 are bigger than non-imprinted polymer (NIP). The Cd2+ ionic imprinting cavity fraction played a role as active sites prepared from different concentrations of Cu2+ ion produces different adsorption rate and capacity upon ion target (Cu2+ ion). Adsorption competition of Cu2+ and H+ ion toward active sites is influential to number of Cu2+ ion adsorbed on NIP and Cu(II)IIP. The higher the concentration of H+ ion, the lower the number of Cu2+ ion adsorbed. The Cu2+ ionic imprinted material from amino-silica hybrid can be used as effective material to bind Cu2+ ion in solution.

Item Type:	Conference or Workshop Item (Paper)
Subjects:	Q Science > QD Chemistry
Divisions:	Fakultas Matematika dan Ilmu Pengetahuan Alam (FMIPA) > Prodi Kimia
Depositing User:	SUHARSO
Date Deposited:	24 Oct 2017 07:48
Last Modified:	24 Oct 2017 07:48
URI:	http://repository.lppm.unila.ac.id/id/eprint/4064

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