Lubis, Muhammad Adly Rahandi and Hidayat, Wahyu and Zaini, Lukmanul Hakim and Park, Byung Dae (2020) Effects of Hydrolysis on the Removal of Cured Urea-Formaldehyde Adhesive in Waste Medium-Density Fiberboard. Jurnal Sylva Lestari, 8 (1). pp. 1-9. ISSN ISSN 2339-0913

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Abstract

The vast production of medium-density fiberboard (MDF) in the world is expected to generate a large quantity of waste MDF after its service life, which requires the recycling of waste MDF (wMDF). This work attempted to investigate the removal of cured urea-formaldehyde (UF) resins adhesive in wMDF using hydrolysis for a possible way of recycling wMDF. The wMDFs were fabricated with two kinds of recycled fibers (RFs): refiner recycled fibers (RRFs) and hammer mill recycled fibers (HRFs) from red and radiata pine. The wMDFs were also produced at different RFs contents, such as 0, 5, 10, 20, 30, 50, and 100%. The panels were then hydrolyzed with water and oxalic acid solution to remove the cured UF resins. The Kjeldahl method was applied to determine the nitrogen (N) content in the panel before and after hydrolysis. Regardless of the wood species and recycling process, the mass loss, pH, and formaldehyde liberation of wMDFs after hydrolysis were greater for oxalic acid than those in water, confirming a greater N content had been extracted by oxalic acid than water. The resin removal became greater as the RFs content increased. In addition, the resin removal was slightly greater in wMDFs made of HRFs than the RRFs. Moreover, red pine RFs gave higher resin removal than radiata pine. These results suggested that a proper combination of the recycling process and additives could make it possible to recycle wMDF panels in the future.

Item Type: Article
Subjects: S Agriculture > SD Forestry
T Technology > T Technology (General)
T Technology > TH Building construction
Divisions: Fakultas Pertanian (FP) > Prodi Kehutanan
Depositing User: Wahyu Hidayat
Date Deposited: 18 May 2020 02:16
Last Modified: 18 May 2020 02:16
URI: http://repository.lppm.unila.ac.id/id/eprint/19792

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